Display device

ABSTRACT

A display device includes: an array substrate; a counter substrate; a liquid crystal layer; and a light source that emits light into a side surface of the array substrate or a side surface of the counter substrate. The display device includes: first wiring lines in a first peripheral region outside a display region, the first wiring lines being configured to be supplied with a constant potential; and second wiring lines in a second peripheral region located opposite to the first peripheral region with the display region therebetween, the second wiring lines being coupled to the scanning lines. A shape of a region occupied by the first wiring lines in the first peripheral region is obtained by inverting a shape of a region occupied by the second wiring lines in the second peripheral region, in a mirror-symmetrical manner. The first wiring lines are not coupled to the scanning lines.

CROSS-REFERENCE TO RELATED APPLICATION

The present application is a divisional application of U.S. Pat.Application No. 17/824,021, filed on May 25, 2022, which is acontinuation application of International Patent Application No.PCT/JP2020/034728 filed on Sep. 14, 2020, which application claims thebenefit of priority from Japanese Patent Application No. 2020-066210filed on Apr. 1, 2020 and Japanese Patent Application No. 2019-217517filed on Nov. 29, 2019, the entire content of each which is hereinincorporated by reference.

BACKGROUND 1. Technical Field

What is disclosed herein relates to a display device.

2. Description of the Related Art

Japanese Patent Application Laid-open Publication No. 2018-021974(JP-A-2018-021974) describes a display device including a firstlight-transmitting substrate, a second light-transmitting substratedisposed so as to be opposed to the first light-transmitting substrate,a liquid crystal layer including polymer-dispersed liquid crystalsfilled between the first light-transmitting substrate and the secondlight-transmitting substrate, and at least one light emitter disposed soas to be opposed to at least one of side surfaces of the firstlight-transmitting substrate and the second light-transmittingsubstrate.

In the display device described in JP-A-2018-021974, a viewer on onesurface side of a display panel can view a background on the othersurface side opposite to the one surface side. Unless a peripheralregion outside a display region transmits light, the background cannotbe seen, which may cause a sense of discomfort. Therefore, theperipheral region outside the display region preferably also allows thebackground on the other surface side opposite to the one surface side tobe seen from the one surface side.

For the foregoing reasons, there is a need for a display device thatreduces the sense of discomfort when the background is viewed throughthe peripheral region outside the display region.

SUMMARY

According to an aspect, a display device includes: an array substrate; acounter substrate; a liquid crystal layer between the array substrateand the counter substrate; and a light source disposed so as to emitlight into a side surface of the array substrate or a side surface ofthe counter substrate. The array substrate includes, in a displayregion, a plurality of signal lines arranged in a first direction withspaces between the signal lines, and a plurality of scanning linesarranged in a second direction with spaces between the scanning lines.The display device includes: a plurality of first wiring lines in afirst peripheral region outside the display region, the first wiringlines being configured to be supplied with a constant potential; and aplurality of second wiring lines in a second peripheral region locatedopposite to the first peripheral region with the display regiontherebetween, the second wiring lines being coupled to the scanninglines. A shape of a region occupied by the first wiring lines in thefirst peripheral region is obtained by inverting a shape of a regionoccupied by the second wiring lines in the second peripheral region, ina mirror-symmetrical manner. The first wiring lines are not coupled tothe scanning lines.

According to an aspect, a display device includes: an array substrate; acounter substrate; a liquid crystal layer between the array substrateand the counter substrate; and a light source disposed so as to emitlight into a side surface of the array substrate or a side surface ofthe counter substrate. The array substrate includes, in a displayregion, a plurality of signal lines arranged in a first direction withspaces between the signal lines, and a plurality of scanning linesarranged in a second direction with spaces between the scanning lines. Amesh-shaped metal layer is provided in a peripheral region outside thedisplay region. A direction of incidence of light from a first sidesurface closest to the light source toward an opposite surface of thefirst side surface is non-orthogonal to a first side forming a mesh ofthe metal layer. The direction of incidence is non-orthogonal to asecond side that forms the mesh and extends in a direction differentfrom the first direction.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating an example of a display deviceaccording to an embodiment of the present disclosure;

FIG. 2 is a block diagram illustrating the display device of a firstembodiment of the present disclosure;

FIG. 3 is a timing diagram explaining timing of light emission by alight source in a field-sequential system of the first embodiment;

FIG. 4 is an explanatory diagram illustrating a relation between avoltage applied to a pixel electrode and a scattering state of a pixel;

FIG. 5 is a sectional view illustrating an example of a section of thedisplay device of FIG. 1 ;

FIG. 6 is a plan view illustrating a planar surface of the displaydevice of FIG. 1 ;

FIG. 7 is an enlarged sectional view obtained by enlarging a liquidcrystal layer portion of FIG. 5 ;

FIG. 8 is a sectional view for explaining a non-scattering state in theliquid crystal layer;

FIG. 9 is a sectional view for explaining the scattering state in theliquid crystal layer;

FIG. 10 is a plan view illustrating scanning lines, signal lines, and aswitching element in the pixel;

FIG. 11 is a plan view illustrating a holding capacitance layer in thepixel;

FIG. 12 is a plan view illustrating an auxiliary metal layer and anopening region in the pixel;

FIG. 13 is a plan view illustrating the pixel electrode in the pixel;

FIG. 14 is a plan view illustrating a light-blocking layer in the pixel;

FIG. 15 is a sectional view along XV-XV′ of FIG. 14 ;

FIG. 16 is a sectional view along XVI-XVI′ of FIG. 14 ;

FIG. 17 is a sectional view along XVII-XVII′ of FIG. 14 ;

FIG. 18 is an explanatory diagram explaining a relation between a viewerand a background, the viewer viewing the background from one surfaceside, the background being located on the other surface side opposite tothe one surface side;

FIG. 19 is an explanatory diagram explaining an example in which aperipheral region overlaps the background;

FIG. 20 is a plan view for explaining the peripheral region of the firstembodiment;

FIG. 21 is a sectional view schematically illustrating a section alongXXI-XXI′ of FIG. 20 ;

FIG. 22 is a plan view for explaining the peripheral region according toa second embodiment of the present disclosure;

FIG. 23 is a plan view explaining a first portion of the peripheralregion of the second embodiment in an enlarged view;

FIG. 24 is a plan view explaining a second portion of the peripheralregion of the second embodiment in an enlarged view;

FIG. 25 is a sectional view schematically illustrating a section alongXXV-XXV′ of FIG. 23 ;

FIG. 26 is a plan view explaining the first portion of the peripheralregion according to a first modification of the second embodiment in anenlarged view;

FIG. 27 is a plan view explaining the first portion of the peripheralregion according to a second modification of the second embodiment in anenlarged view;

FIG. 28 is a plan view explaining the first portion of the peripheralregion according to a third modification of the second embodiment in anenlarged view;

FIG. 29 is a plan view explaining the second portion of the peripheralregion according to the third modification of the second embodiment inan enlarged view;

FIG. 30 is a plan view explaining the first portion of the peripheralregion according to a fourth modification of the second embodiment in anenlarged view; and

FIG. 31 is a plan view explaining the second portion of the peripheralregion according to the fourth modification of the second embodiment inan enlarged view.

DETAILED DESCRIPTION

The following describes modes (embodiments) for carrying out the presentdisclosure in detail with reference to the drawings. The presentdisclosure is not limited to the description of the embodiments givenbelow. Components described below include those easily conceivable bythose skilled in the art or those substantially identical thereto. Inaddition, the components described below can be combined as appropriate.What is disclosed herein is merely an example, and the presentdisclosure naturally encompasses appropriate modifications easilyconceivable by those skilled in the art while maintaining the gist ofthe disclosure. To further clarify the description, the drawingsschematically illustrate, for example, widths, thicknesses, and shapesof various parts as compared with actual aspects thereof, in some cases.However, they are merely examples, and interpretation of the presentdisclosure is not limited thereto. The same element as that illustratedin a drawing that has already been discussed is denoted by the samereference numeral through the description and the drawings, and detaileddescription thereof will not be repeated in some cases whereappropriate.

In this disclosure, when an element is described as being “on” anotherelement, the element can be directly on the other element, or there canbe one or more elements between the element and the other element.

First Embodiment

FIG. 1 is a perspective view illustrating an example of a display deviceaccording to a first embodiment of the present disclosure. FIG. 2 is ablock diagram illustrating the display device of FIG. 1 . FIG. 3 is atiming diagram explaining timing of light emission by a light source ina field-sequential system.

As illustrated in FIG. 1 , a display device 1 includes a display panel2, a light source 3, and a drive circuit 4. A direction PX denotes onedirection in the plane of the display panel 2. A second direction PYdenotes a direction orthogonal to the direction PX. A third direction PZdenotes a direction orthogonal to the PX-PY plane.

The display panel 2 includes an array substrate 10, a counter substrate20, and a liquid crystal layer 50 (refer to FIG. 5 ). The countersubstrate 20 is opposed to a surface of the array substrate 10 in adirection orthogonal thereto (in the direction PZ as indicated in FIG. 1). In the liquid crystal layer 50 (refer to FIG. 5 ), polymer-dispersedliquid crystals LC (described later) are sealed by the array substrate10, the counter substrate 20, and a sealing portion 18.

As illustrated in FIG. 1 , the display panel 2 has a display region AAcapable of displaying images and a peripheral region FR outside thedisplay region AA. A plurality of pixels Pix are arranged in a matrixhaving a row-column configuration in the display region AA. In thepresent disclosure, a row refers to a pixel row including m pixels Pixarranged in one direction. In addition, a column refers to a pixelcolumn including n pixels Pix arranged in a direction orthogonal to thedirection in which the rows extend. The values of m and n are determineddepending on a display resolution in the vertical direction and adisplay resolution in the horizontal direction. A plurality of scanninglines GL are provided corresponding to the rows, and a plurality ofsignal lines SL are provided corresponding to the columns.

The light source 3 includes a plurality of light emitters 31. Asillustrated in FIG. 2 , a light source controller (light source controlcircuit) 32 is included in the drive circuit 4. The light sourcecontroller 32 may be a circuit separate from the drive circuit 4. Thelight emitters 31 are electrically coupled to the light sourcecontroller 32 through wiring in the array substrate 10.

As illustrated in FIG. 1 , the drive circuit 4 is fixed to the surfaceof the array substrate 10. As illustrated in FIG. 2 , the drive circuit4 includes a signal processing circuit 41, a pixel control circuit 42, agate drive circuit 43, a source drive circuit 44, and a common potentialdrive circuit 45. The array substrate 10 has an area in the PX-PY planelarger than that of the counter substrate 20, and the drive circuit 4 isprovided on a projecting portion of the array substrate 10 exposed fromthe counter substrate 20.

The signal processing circuit 41 receives a first input signal (such asa red-green-blue (RGB) signal) VS from an image transmitter 91 of anexternal host controller 9 through a flexible substrate 92.

The signal processing circuit 41 includes an input signal analyzer 411,a storage 412, and a signal adjuster 413. The input signal analyzer 411generates a second input signal VCS based on an externally receivedfirst input signal VS.

The second input signal VCS is a signal for determining a gradationvalue to be given to each of the pixels Pix of the display panel 2 basedon the first input signal VS. In other words, the second input signalVCS is a signal including gradation information on the gradation valueof each of the pixels Pix.

The signal adjuster 413 generates a third input signal VCSA from thesecond input signal VCS. The signal adjuster 413 transmits the thirdinput signal VCSA to the pixel control circuit 42, and transmits a lightsource control signal LCSA to the light source controller 32. The lightsource control signal LCSA is a signal including information on lightquantities of the light emitters 31 set in accordance with, for example,input gradation values given to the pixels Pix. For example, when adarker image is displayed, the light quantities of the light emitters 31are set smaller. When a brighter image is displayed, the lightquantities of the light emitters 31 are set larger.

The pixel control circuit 42 generates a horizontal drive signal HDS anda vertical drive signal VDS based on the third input signal VCSA. In thepresent embodiment, since the display device 1 is driven based on thefield-sequential system, the horizontal drive signal HDS and thevertical drive signal VDS are generated for each color emittable by thelight emitter 31.

The gate drive circuit 43 sequentially selects the scanning lines GL ofthe display panel 2 based on the horizontal drive signal HDS during onevertical scanning period. The scanning lines GL can be selected in anyorder. The gate drive circuit 43 is electrically coupled to the scanninglines GL through second wiring lines GPL arranged in the peripheralregion FR outside the display region AA (refer to FIG. 1 ).

The source drive circuit 44 supplies a gradation signal corresponding tothe output gradation value of each of the pixels Pix to a correspondingone of the signal lines SL of the display panel 2 based on the verticaldrive signal VDS during one horizontal scanning period.

In the present embodiment, the display panel 2 is an active matrixpanel. Hence, the display panel 2 is provided with the signal (source)lines SL extending in the second direction PY and the scanning (gate)lines GL extending in the first direction PX in a plan view, andswitching elements Tr are provided at intersecting portions between thesignal lines SL and the scanning lines GL.

A thin-film transistor is used as each of the switching elements Tr. Abottom-gate transistor or a top-gate transistor may be used as anexample of the thin-film transistor. Although a single-gate thin filmtransistor is exemplified as the switching element Tr, the switchingelement Tr may be a double-gate transistor. One of the source electrodeand the drain electrode of the switching element Tr is coupled to acorresponding one of the signal lines SL. The gate electrode of theswitching element Tr is coupled to a corresponding one of the scanninglines GL. The other of the source electrode and the drain electrode iscoupled to one end of a capacitance of the polymer-dispersed liquidcrystals LC described later. The capacitance of the polymer-dispersedliquid crystals LC is coupled at one end thereof to the switchingelement Tr through a pixel electrode PE, and coupled at the other endthereof to common potential wiring COML through a common electrode CE. Aholding capacitance HC is generated between the pixel electrode PE and aholding capacitance electrode IO electrically coupled to the commonpotential wiring COML. A potential of the common potential wiring COMLis supplied by the common potential drive circuit 45.

Each of the light emitters 31 includes a light emitter 33R of a firstcolor (such as red), a light emitter 33G of a second color (such asgreen), and a light emitter 33B of a third color (such as blue). Thelight source controller 32 controls the light emitter 33R of the firstcolor, the light emitter 33G of the second color, and the light emitter33B of the third color so as to emit light in a time-division mannerbased on the light source control signal LCSA. In this manner, the lightemitter 33R of the first color, the light emitter 33G of the secondcolor, and the light emitter 33B of the third color are driven based onthe field-sequential system.

As illustrated in FIG. 3 , in a first sub-frame (first predeterminedtime) RF, the light emitter 33R of the first color emits light during afirst color light emission period RON, and the pixels Pix selectedduring one vertical scanning period GateScan scatter light to performdisplay. On the entire display panel 2, if the gradation signalcorresponding to the output gradation value of each of the pixels Pix issupplied to the above-described signal lines SL for the pixels Pixselected during the one vertical scanning period GateScan, only thefirst color is lit up during the first color light emission period RON.

Then, in a second sub-frame (second predetermined time) GF, the lightemitter 33G of the second color emits light during a second color lightemission period GON, and the pixels Pix selected during the one verticalscanning period GateScan scatter light to perform display. On the entiredisplay panel 2, if the gradation signal corresponding to the outputgradation value of each of the pixels Pix is supplied to theabove-described signal lines SL for the pixels Pix selected during theone vertical scanning period GateScan, only the second color is lit upduring the second color light emission period GON.

Further, in a third sub-frame (third predetermined time) BF, the lightemitter 33B of the third color emits light during a third color lightemission period BON, and the pixels Pix selected during the one verticalscanning period GateScan scatter light to perform display. On the entiredisplay panel 2, if the gradation signal corresponding to the outputgradation value of each of the pixels Pix is supplied to theabove-described signal lines SL for the pixels Pix selected during theone vertical scanning period GateScan, only the third color is lit upduring the third color light emission period BON.

Since a human eye has limited temporal resolving power, and produces anafterimage, an image with a combination of three colors is recognized ina period of one frame (1F). The field-sequential system can eliminatethe need for a color filter, and thus can reduce an absorption loss bythe color filter. As a result, higher transmittance can be obtained. Inthe color filter system, one pixel is made up of sub-pixels obtained bydividing each of the pixels Pix into the sub-pixels of the first color,the second color, and the third color. In contrast, in thefield-sequential system, the pixel need not be divided into thesub-pixels in such a manner. A fourth sub-frame may be further includedto emit light in a fourth color different from any one of the firstcolor, the second color, and the third color.

FIG. 4 is an explanatory diagram illustrating a relation between avoltage applied to the pixel electrode and a scattering state of thepixel. FIG. 5 is a sectional view illustrating an example of a sectionof the display device of FIG. 1 . FIG. 6 is a plan view illustrating aplanar surface of the display device of FIG. 1 . FIG. 5 is a V-V′sectional view of FIG. 6 . FIG. 7 is an enlarged sectional view obtainedby enlarging the liquid crystal layer portion of FIG. 5 . FIG. 8 is asectional view for explaining a non-scattering state in the liquidcrystal layer. FIG. 9 is a sectional view for explaining the scatteringstate in the liquid crystal layer.

If the gradation signal corresponding to the output gradation value ofeach of the pixels Pix is supplied to the above-described signal linesSL for the pixels Pix selected during the one vertical scanning periodGateScan, the voltage applied to the pixel electrode PE changes with thegradation signal. The change in the voltage applied to the pixelelectrode PE changes the voltage between the pixel electrode PE and thecommon electrode CE. The scattering state of the liquid crystal layer 50for each of the pixels Pix is controlled in accordance with the voltageapplied to the pixel electrode PE, and the scattering rate in the pixelPix changes, as illustrated in FIG. 4 .

As illustrated in FIG. 4 , the change in the scattering rate in thepixel Pix is smaller when the voltage applied to the pixel electrode PEis substantially equal to or higher than a saturation voltage Vsat.Therefore, the drive circuit 4 changes the voltage applied to the pixelelectrode PE in accordance with the vertical drive signal VDS in avoltage range Vdr lower than the saturation voltage Vsat.

As illustrated in FIGS. 5 and 6 , the array substrate 10 has a firstprincipal surface 10A, a second principal surface 10B, a first sidesurface 10C, a second side surface 10D, a third side surface 10E, and afourth side surface 10F. The first principal surface 10A and the secondprincipal surface 10B are parallel flat surfaces. The first side surface10C and the second side surface 10D are parallel flat surfaces. Thethird side surface 10E and the fourth side surface 10F are parallel flatsurfaces.

As illustrated in FIGS. 5 and 6 , the counter substrate 20 has a firstprincipal surface 20A, a second principal surface 20B, a first sidesurface 20C, a second side surface 20D, a third side surface 20E, and afourth side surface 20F. The first principal surface 20A and the secondprincipal surface 20B are parallel flat surfaces. The first side surface20C and the second side surface 20D are parallel flat surfaces. Thethird side surface 20E and the fourth side surface 20F are parallel flatsurfaces.

As illustrated in FIGS. 5 and 6 , the light source 3 is opposed to thesecond side surface 20D of the counter substrate 20. The light source 3is sometimes called a side light source. As illustrated in FIG. 5 , thelight source 3 emits light-source light L to the second side surface 20Dof the counter substrate 20. The second side surface 20D of the countersubstrate 20 opposed to the light source 3 serves as a plane of lightincidence.

As illustrated in FIG. 5 , the light-source light L emitted from thelight source 3 propagates in a direction (second direction PY) away fromthe second side surface 20D while being reflected by the first principalsurface 10A of the array substrate 10 and the first principal surface20A of the counter substrate 20. When the light-source light L travelsoutward from the first principal surface 10A of the array substrate 10or the first principal surface 20A of the counter substrate 20, thelight-source light L enters a medium having a lower refractive indexfrom a medium having a higher refractive index. Hence, if the angle ofincidence of the light-source light L incident on the first principalsurface 10A of the array substrate 10 or the first principal surface 20Aof the counter substrate 20 is larger than a critical angle, thelight-source light L is totally reflected by the first principal surface10A of the array substrate 10 or the first principal surface 20A of thecounter substrate 20.

As illustrated in FIG. 5 , the light-source light L that has propagatedin the array substrate 10 and the counter substrate 20 is scattered byany of the pixels Pix including the liquid crystals placed in thescattering state, and the angle of incidence of the scattered lightbecomes an angle smaller than the critical angle. Thus, emission light68 and 68A are emitted outward from the first principal surface 20A ofthe counter substrate 20 and the first principal surface 10A of thearray substrate 10. The emission light 68 and 68A emitted outward fromthe first principal surface 20A of the counter substrate 20 and thefirst principal surface 10A of the array substrate 10, respectively, areviewed by a viewer. The following describes the polymer-dispersed liquidcrystals placed in the scattering state and the polymer-dispersed liquidcrystals in a non-scattering state, using FIGS. 7 to 9 .

As illustrated in FIG. 7 , the array substrate 10 is provided with afirst orientation film AL1. The counter substrate 20 is provided with asecond orientation film AL2. The first and the second orientation filmsAL1 and AL2 are, for example, vertical orientation films.

A solution containing the liquid crystals and a monomer is filledbetween the array substrate 10 and the counter substrate 20. Then, in astate where the monomer and the liquid crystals are oriented by thefirst and the second orientation films AL1 and AL2, the monomer ispolymerized by ultraviolet rays or heat to form a bulk 51. This processforms the liquid crystal layer 50 including the reverse-modepolymer-dispersed liquid crystals LC in which the liquid crystals aredispersed in gaps of a polymer network formed in a mesh shape.

In this manner, the polymer-dispersed liquid crystals LC include thebulk 51 formed of the polymer and a plurality of fine particles 52dispersed in the bulk 51. The fine particles 52 are formed of the liquidcrystals. Both the bulk 51 and the fine particles 52 have opticalanisotropy.

The orientation of the liquid crystals included in the fine particles 52is controlled by a voltage difference between the pixel electrode PE andthe common electrode CE. The orientation of the liquid crystals ischanged by the voltage applied to the pixel electrode PE. The degree ofscattering of light passing through the pixels Pix changes with changein the orientation of the liquid crystals.

For example, as illustrated in FIG. 8 , when no voltage is appliedbetween the pixel electrode PE and the common electrode CE, thedirection of an optical axis Ax 1 of the bulk 51 is substantially equalto the direction of an optical axis Ax 2 of the fine particles 52. Theoptical axis Ax 2 of the fine particles 52 is parallel to the directionPZ of the liquid crystal layer 50. The optical axis Ax 1 of the bulk 51is parallel to the direction PZ of the liquid crystal layer 50regardless of whether a voltage is applied.

Ordinary-ray refractive indices of the bulk 51 and the fine particles 52are equal to each other. When no voltage is applied between the pixelelectrode PE and the common electrode CE, the difference of refractiveindex between the bulk 51 and the fine particles 52 is zero in alldirections. The liquid crystal layer 50 is placed in the non-scatteringstate of not scattering the light-source light L. The light-source lightL propagates in a direction away from the light source 3 (the lightemitter 31) while being reflected by the first principal surface 10A ofthe array substrate 10 and the first principal surface 20A of thecounter substrate 20. When the liquid crystal layer 50 is in thenon-scattering state of not scattering the light-source light L, abackground on the first principal surface 20A side of the countersubstrate 20 is visible from the first principal surface 10A of thearray substrate 10, and a background on the first principal surface 10Aside of the array substrate 10 is visible from the first principalsurface 20A of the counter substrate 20.

As illustrated in FIG. 9 , in the space between the pixel electrode PEand the common electrode CE having a voltage applied thereto, theoptical axis Ax 2 of the fine particles 52 is inclined by an electricfield generated between the pixel electrode PE and the common electrodeCE. Since the optical axis Ax 1 of the bulk 51 is not changed by theelectric field, the direction of the optical axis Ax 1 of the bulk 51differs from the direction of the optical axis Ax 2 of the fine particle52. The light-source light L is scattered in the pixel Pix including thepixel electrode PE having a voltage applied thereto. As described above,the viewer views a part of the scattered light-source light L emittedoutward from the first principal surface 10A of the array substrate 10or the first principal surface 20A of the counter substrate 20.

In the pixel Pix including the pixel electrode PE having no voltageapplied thereto, the background on the first principal surface 20A sideof the counter substrate 20 is visible from the first principal surface10A of the array substrate 10, and the background on the first principalsurface 10A side of the array substrate 10 is visible from the firstprincipal surface 20A of the counter substrate 20. In the display device1 of the present embodiment, when the first input signal VS is receivedfrom the image transmitter 91, a voltage is applied to the pixelelectrode PE of the pixel Pix to display an image, and the image basedon the third input signal VCSA becomes visible together with thebackground. In this manner, an image is displayed in the display regionwhen the polymer-dispersed liquid crystals are in a scattering state.

The light-source light L is scattered in the pixel Pix including thepixel electrode PE having a voltage applied thereto, and emitted outwardto display the image, which is displayed so as to be superimposed on thebackground. In other words, the display device 1 of the presentembodiment combines the emission light 68 or the emission light 68A withthe background to display the image so as to be superimposed on thebackground.

A potential of each of the pixel electrodes PE (refer to FIG. 7 )written during the one vertical scanning period GateScan illustrated inFIG. 3 needs to be held during at least one of the first color lightemission period RON, the second color light emission period GON, and thethird color light emission period BON coming after the one verticalscanning period GateScan. If the written potential of each of the pixelelectrodes PE (refer to FIG. 7 ) cannot be held during at least one ofthe first color light emission period RON, the second color lightemission period GON, and the third color light emission period BONcoming after the one vertical scanning period GateScan, what are calledflickers, for example, are likely to occur. In other words, in order toshorten the one vertical scanning period GateScan serving as a time forselecting the scanning lines and increase the visibility in the drivingbased on what is called the field-sequential system, the writtenpotential of each of the pixel electrodes PE (refer to FIG. 7 ) isrequired to be easily held during each of the first color light emissionperiod RON, the second color light emission period GON, and the thirdcolor light emission period BON.

FIG. 10 is a plan view illustrating the scanning lines, the signallines, and the switching element in the pixel. FIG. 11 is a plan viewillustrating a holding capacitance layer in the pixel. FIG. 12 is a planview illustrating an auxiliary metal layer and an opening region in thepixel. FIG. 13 is a plan view illustrating the pixel electrode in thepixel. FIG. 14 is a plan view illustrating a light-blocking layer in thepixel. FIG. 15 is a sectional view along XV-XV′ of FIG. 14 . FIG. 16 isa sectional view along XVI-XVI′ of FIG. 14 . FIG. 17 is a sectional viewalong XVII-XVII′ of FIG. 14 . As illustrated in FIGS. 1, 2, and 10 , thearray substrate 10 is provided with the signal lines SL and the scanninglines GL so as to form a grid in the plan view. In other words, onesurface of the array substrate 10 is provided with the signal linesarranged with spaces therebetween in the first direction PX and thescanning lines arranged with spaces therebetween in the second directionPY.

As illustrated in FIG. 10 , a region surrounded by the adjacent scanninglines GL and the adjacent signal lines SL corresponds to the pixel Pix.The pixel Pix is provided with the pixel electrode PE and the switchingelement Tr. In the present embodiment, the switching element Tr is abottom-gate thin film transistor. The switching element Tr includes asemiconductor layer SC overlapping, in the plan view, a gate electrodeGE electrically coupled to a corresponding one of the scanning lines GL.

As illustrated in FIG. 10 , the scanning lines GL are wiring of a metalsuch as molybdenum (Mo) or aluminum (Al), a multi-layered body of thesemetals, or an alloy thereof. The signal lines SL are wiring of a metalsuch as aluminum or an alloy thereof.

As illustrated in FIG. 10 , the semiconductor layer SC is provided so asnot to protrude from the gate electrode GE in the plan view. As aresult, the light-source light L traveling toward the semiconductorlayer SC from the gate electrode GE side is reflected, and light leakageis less likely to occur in the semiconductor layer SC.

As illustrated in FIGS. 5 and 20 , the light-source light L emitted fromthe light source 3 is incident in the second direction PY serving as adirection of incidence. The direction of incidence refers to a directionfrom the second side surface 20D closest to the light source 3 towardthe first side surface 20C that is an opposite surface of the secondside surface 20D. When the direction of incidence of the light-sourcelight L is the second direction PY, the length in the first direction PXof the semiconductor layer SC is less than the length in the seconddirection PY of the semiconductor layer SC. This configuration reducesthe length in a direction intersecting the direction of incidence of thelight-source light L, and thereby, reduces the effect of light leakage.

As illustrated in FIG. 10 , two electrical conductors of sourceelectrodes SE that are the same as the signal line SL extend from thesignal line SL in the same layer as that of the signal line SL and in adirection intersecting the signal line SL. With this configuration, thesource electrodes SE electrically coupled to the signal line SL overlapone end of the semiconductor layer SC in the plan view.

As illustrated in FIG. 10 , in the plan view, a drain electrode DE isprovided in a position between the adjacent electrical conductors of thesource electrodes SE. The drain electrode DE overlaps the semiconductorlayer SC in the plan view. A portion of the semiconductor layer SCoverlapping neither the source electrodes SE nor the drain electrode DEserves as a channel of the switching element Tr. As illustrated in FIG.13 , a contact electrode DEA electrically coupled to the drain electrodeDE is electrically coupled to the pixel electrode PE through a contacthole CH.

As illustrated in FIG. 15 , the array substrate 10 includes a firstlight-transmitting base member 19 formed of, for example, glass. Thefirst light-transmitting base member 19 may be any material having alight transmitting capability and may be, for example, a resin such aspolyethylene terephthalate.

As illustrated in FIG. 15 , the scanning line GL (refer to FIG. 10 ) andthe gate electrode GE are provided on the first light-transmitting basemember 19.

In addition, as illustrated in FIG. 15 , a first insulating layer 11 isprovided so as to cover the scanning line GL and the gate electrode GE.The first insulating layer 11 is formed of, for example, a transparentinorganic insulating material such as silicon nitride.

The semiconductor layer SC is stacked on the first insulating layer 11.The semiconductor layer SC is formed of, for example, amorphous silicon,but may be formed of polysilicon or an oxide semiconductor. When viewedin the same section, a length Lsc of the semiconductor layer SC is lessthan a length Lge of the gate electrode GE overlapping the semiconductorlayer SC. With this configuration, the gate electrode GE can block lightLd1 that has propagated in the first light-transmitting base member 19.As a result, the light leakage of the switching element Tr of the firstembodiment is reduced.

The source electrode SE and the signal line SL covering portions of thesemiconductor layer SC and the drain electrode DE covering a portion ofthe semiconductor layer SC are provided on the first insulating layer11. The drain electrode DE is formed of the same material as that of thesignal line SL. A second insulating layer 12 is provided on thesemiconductor layer SC, the signal line SL, and the drain electrode DE.The second insulating layer 12 is formed of, for example, a transparentinorganic insulating material such as silicon nitride, in the samemanner as the first insulating layer.

A third insulating layer covering a portion of the second insulatinglayer 12 is formed on the second insulating layer 12. A third insulatinglayer 13 is formed of, for example, a light-transmitting organicinsulating material such as an acrylic resin. The third insulating layer13 has a film thickness greater than other insulating films formed of aninorganic material.

As illustrated in FIGS. 15, 16, and 17 , some regions have the thirdinsulating layer 13 while the other regions do not have the thirdinsulating layer 13. As illustrated in FIGS. 16 and 17 , the regionshaving the third insulating layer 13 are located over the scanning linesGL and over the signal lines SL. The third insulating layer 13 has agrid shape that extends along the scanning lines GL and the signal linesSL and overlies (i.e., covers) the scanning lines GL and the signallines SL. As illustrated in FIG. 15 , the regions having the thirdinsulating layer 13 are also located over the semiconductor layer SC,that is, over the switching elements Tr. As a result, the switchingelement Tr, the scanning line GL, and the signal line SL are located atrelatively long distances from the holding capacitance electrode IO, andare thereby less affected by a common potential from the holdingcapacitance electrode IO. In addition, regions on the array substrate 10not having the third insulating layer 13 are provided in the regionssurrounded by the scanning lines GL and the signal lines SL. Thus,regions are provided in which the thickness of the insulating layer isless than the thickness of the insulating layer overlapping the signallines SL and the scanning lines GL in the plan view. The regionssurrounded by the scanning lines GL and the signal lines SL haverelatively higher optical transmittance than the regions over thescanning lines GL and over the signal lines SL, and thus, are improvedin light transmitting capability.

As illustrated in FIG. 15 , a metal layer TM is provided on the thirdinsulating layer 13. The conductive metal layer TM is wiring of a metalsuch as molybdenum (Mo) or aluminum (Al), a layered body of thesemetals, or an alloy thereof. As illustrated in FIG. 12 , the metal layerTM is provided in a region overlapping the signal lines SL, the scanninglines GL, and the switching elements Tr in the plan view. With thisconfiguration, the metal layer TM is formed into a grid shape, andopenings AP surrounded by the metal layer TM are formed.

As illustrated in FIG. 15 , the holding capacitance electrode IO isprovided above the third insulating layer 13 and the metal layer TM. Theholding capacitance electrode IO is formed of a light-transmittingconductive material such as indium tin oxide (ITO). The holdingcapacitance electrode IO is also called “third light-transmittingelectrode”. As illustrated in FIG. 11 , the holding capacitanceelectrode IO has a region IOX including no light-transmitting conductivematerial in each of the regions surrounded by the scanning lines GL andthe signal lines SL. The holding capacitance electrode IO extends acrossthe adjacent pixels Pix and is provided over the pixels Pix. A region ofthe holding capacitance electrode IO including the light-transmittingconductive material overlaps the scanning line GL or the signal line SL,and extends to the adjacent pixel Pix.

The holding capacitance electrode IO has a grid shape that extends alongthe scanning lines GL and the signal lines SL and overlies (i.e.,covers) the scanning lines GL and the signal lines SL. With thisconfiguration, the holding capacitance HC between the region IOXincluding no light-transmitting conductive material and the pixelelectrode PE is reduced. Therefore, the holding capacitance HC isadjusted by the size of the region IOX including no light-transmittingconductive material.

As illustrated in FIG. 12 , the switching element Tr that is coupled toa corresponding one of the scanning lines GL and a corresponding one ofthe signal lines SL is provided. At least the switching element Tr iscovered with the third insulating layer 13 serving as an organicinsulating layer, and the metal layer TM having a larger area than thatof the switching element Tr is located above the third insulating layer13. This configuration can reduce the light leakage of the switchingelement Tr.

More specifically, the array substrate 10 includes the third insulatinglayer 13 serving as an organic insulating layer that covers at least theswitching element Tr, and includes the metal layer TM that is providedon the third insulating layer 13 so as to overlap therewith, and has alarger area than that of the switching element Tr. The region surroundedby the scanning lines GL and the signal lines SL has a region having athickness less than that of the third insulating layer 13 that overlapsthe scanning lines GL and the signal lines SL in the plan view. Thisconfiguration provides slant surfaces, one of which is located on a sideof the third insulating layer 13 closer to the light source 3 than theswitching element Tr is, in the plan view, and changes in thickness. Asillustrated in FIG. 5 , the light-source light L emitted from the lightsource 3 is incident in the second direction PY serving as the directionof incidence. As illustrated in FIG. 15 , the above-mentioned slantsurfaces include a first slant surface 13F on a side of the thirdinsulating layer 13 where light Lu of the light-source light L isincident, and a second slant surface 13R on a side of the thirdinsulating layer 13 opposite to the side where the light Lu is incident.As illustrated in FIG. 15 , a metal layer TMt covers the first slantsurface 13F on the side of the third insulating layer 13 where the lightLu is incident. The metal layer TMt is a tapered portion that is formedof the same material as that of the metal layer TM, and is formed byextending the metal layer TM.

As illustrated in FIG. 15 , the light Lu arrives in the direction ofincidence. The light Lu is a part of the light-source light L thatarrives from a side closer to the light source 3 than the switchingelement Tr is. The metal layer TMt blocks the light Lu, and thereby,reduces light leakage.

If the second slant surface 13R is covered with the metal layer TM andthe background of the counter substrate 20 is visible from the arraysubstrate 10, light Ld2 viewed by the viewer is reflected by the metallayer TM covering the second slant surface 13R, and the reflected lightmay be visible by the viewer. In the first embodiment, none of the metallayer TM covers the second slant surface 13R. As a result, the displaydevice of the first embodiment reduces the reflected light that hindersthe vision of the viewer.

The metal layer TM may be located on the upper side of the holdingcapacitance electrode IO, and only needs to be stacked with the holdingcapacitance electrode IO. The metal layer TM has a lower electricalresistance than that of the holding capacitance electrode IO. Therefore,the potential of the holding capacitance electrode IO is restrained fromvarying with the position where the pixel Pix is located in the displayregion AA.

As illustrated in FIG. 12 , the width of the metal layer TM overlappingthe signal line SL is greater than the width of the signal line SL inthe plan view. This configuration restrains reflected light reflected byedges of the signal line SL from being emitted from the display panel 2.The width of the metal layer TM and the width of the signal line SL arelengths in a direction intersecting the extending direction of thesignal line SL. The width of the metal layer TM overlapping the scanningline GL is larger than the width of the scanning line GL. The width ofthe metal layer TM and the width of the scanning line GL are lengths ina direction intersecting the extending direction of the scanning lineGL.

As illustrated in FIG. 15 , a fourth insulating layer 14 is provided onthe upper side of the holding capacitance electrode IO and the metallayer TM. The fourth insulating layer 14 is an inorganic insulatinglayer formed of, for example, a transparent inorganic insulatingmaterial such as silicon nitride.

As illustrated in FIG. 15 , the pixel electrode PE is provided on thefourth insulating layer 14. The pixel electrode PE is formed of alight-transmitting conductive material such as ITO. The pixel electrodePE is electrically coupled to the contact electrode DEA through thecontact hole CH provided in the fourth insulating layer 14, the thirdinsulating layer 13, and the second insulating layer 12. As illustratedin FIG. 13 , each of the pixel electrodes PE is partitioned off on apixel Pix basis. The first orientation film AL1 is provided on the upperside of the pixel electrode PE.

As illustrated in FIG. 15 , the counter substrate 20 includes a secondlight-transmitting base member 29 formed of, for example, glass. Thematerial of the second light-transmitting base member 29 may be anymaterial having a light transmitting capability and may be, for example,a resin such as polyethylene terephthalate. The secondlight-transmitting base member 29 is provided with the common electrodeCE. The common electrode CE is formed of a light-transmitting conductivematerial such as ITO. The second orientation film AL2 is provided on asurface of the common electrode CE. The counter substrate 20 includes alight-blocking layer LS between the second light-transmitting basemember 29 and the common electrode CE. The light-blocking layer LS isformed of a black resin or a metal material. A spacer PS is formedbetween the array substrate 10 and the counter substrate 20. The spacerPS is formed between the common electrodes CE and the second orientationfilm AL2

As illustrated in FIGS. 12 and 16 , in the display device of the firstembodiment, a light-blocking layer GS located in the same layer as thatof the scanning line GL is provided in a position extending along thesignal line SL and overlapping a portion of the signal line SL. Thelight-blocking layer GS is formed of the same material as that of thescanning line GL. The light-blocking layer GS is not provided at aportion where the scanning line GL intersects the signal line SL in theplan view.

As illustrated in FIG. 12 , the light-blocking layer GS is electricallycoupled to the signal line SL through a contact hole CHG. With thisconfiguration, the wiring resistance of a combination of thelight-blocking layer GS and the signal line SL is lower than that ofonly the signal line SL. As a result, the delay of the gradation signalsupplied to the signal line SL is restrained. The contact hole CHG neednot be provided, and the light-blocking layer GS need not be coupled tothe signal line SL.

As illustrated in FIG. 16 , the light-blocking layer GS is providedopposite to the metal layer TM with the signal line SL therebetween. Thewidth of the light-blocking layer GS is greater than that of the signalline SL, and less than that of the metal layer TM. The width of thelight-blocking layer GS, the width of the metal layer TM, and the widthof the signal line SL are lengths in a direction intersecting theextending direction of the signal line SL. In this manner, thelight-blocking layer GS has a greater width than that of the signal lineSL, and thus, restrains the reflected light reflected by the edges ofthe signal line SL from being emitted from the display panel 2. As aresult, the visibility of images is improved in the display device 1.

As illustrated in FIGS. 14 and 15 , the counter substrate 20 is providedwith the light-blocking layer LS. The light-blocking layer LS isprovided in a region overlapping the signal line SL, the scanning lineGL, and the switching element Tr in the plan view.

As illustrated in FIGS. 14, 15, 16, and 17 , the light-blocking layer LShas a greater width than that of the metal layer TM. This configurationrestrains reflected light reflected by edges of the signal line SL, thescanning line GL, and the metal layer TM from being emitted from thedisplay panel 2. As a result, the visibility of images is improved inthe display device 1.

The contact hole CH and the contact hole CHG are likely to diffuselyreflect the light-source light L emitted thereto. Therefore, thelight-blocking layer LS is provided in a region overlapping the contacthole CH and the contact hole CHG in the plan view.

As illustrated on FIG. 15 , the spacer SP is disposed between the arraysubstrate 10 and the counter substrate 20 and improves the uniformity ofthe distance between the array substrate 10 and the counter substrate20.

FIG. 18 is an explanatory diagram explaining a relation between theviewer and the background, the viewer viewing the background from onesurface side, the background being located on the other surface sideopposite to the one surface side. FIG. 19 is an explanatory diagramexplaining an example in which the peripheral region overlaps thebackground. As illustrated in FIG. 18 , when a viewer IB views the othersurface side of the display device 1 from the one surface side thereof,a background BS1 is viewed through the display device 1. If a firstperipheral region FR1 outside the display region AA does not transmitlight, the background BS1 is invisible and thereby, a sense ofdiscomfort may be caused. Therefore, the background BS1 on the othersurface side opposite to the one surface side is made visible from theone surface side of the display device 1 through also the firstperipheral region FR1 and a second peripheral region FR2, as illustratedin FIG. 19 .

FIG. 20 is a plan view for explaining the peripheral region of the firstembodiment. FIG. 21 is a sectional view schematically illustrating asection along XXI-XXI′ of FIG. 20 . The peripheral region FR illustratedin FIG. 1 includes the first peripheral region FR1 and the secondperipheral region FR2 illustrated in FIG. 20 . The first peripheralregion FR1 and the second peripheral region FR2 are arranged with thedisplay region AA interposed therebetween in the first direction PX. Thesecond wiring lines GPL are disposed in a second portion Q2 of thesecond peripheral region FR2. As illustrated in FIG. 2 , the secondwiring lines GPL electrically couple the gate drive circuit 43 of thedrive circuit 4 to the scanning lines GL. The second wiring lines GPLare formed in the same layer as that of the scanning lines GL, and areformed of the same material as that of the scanning lines GL.

In the first embodiment, no wiring for electrically coupling the gatedrive circuit 43 to the scanning lines GL is present in the firstperipheral region FR1. The second wiring lines GPL reduce thetransmittance of the second peripheral region FR2. If the transmittanceof the first peripheral region FR1 greatly differs from that of thesecond peripheral region FR2, the viewer may be given a sense ofdiscomfort. Therefore, as illustrated in FIG. 20 , in the display device1 of the first embodiment, first wiring lines DPL are disposed in afirst portion Q1 of the first peripheral region FR1. As illustrated inFIG. 21 , the first wiring lines DPL are formed in the same layer asthat of the scanning line GL, and is formed of the same material that ofthe scanning line GL. As a result, the transmittance of the firstperipheral region FR1 is substantially the same as that of the secondperipheral region FR2.

The first wiring lines DPL are coupled to the common potential drivecircuit 45 illustrated in FIG. 2 , and are at substantially the samepotential as that of the common potential wiring COML described above.This configuration reduces noise generated in the display region AA. Thepotential of the first wiring lines DPL is not limited to the commonpotential, and only needs to be a constant potential.

As illustrated in FIG. 21 , the counter substrate 20 includes thelight-blocking layer LS that at least partially covers the signal lineSL and scanning line GL. In contrast, the light-blocking layer LS doesnot cover the first wiring lines DPL and the second wiring lines GPL. Asa result, the first peripheral region FR1 is not provided with thelight-blocking layer LS, and therefore, easily transmits light. However,the viewer is also likely to notice a difference in contrast between thefirst peripheral region FR1 and the second peripheral region FR2.Therefore, in the first embodiment, as illustrated in FIG. 20 , theshape of a region occupied by the first wiring lines DPL in the firstperipheral region FR1 is a shape obtained by inverting the shape of aregion occupied by the second wiring lines GPL in the second peripheralregion FR2, in a mirror-symmetrical manner. This configuration makes itdifficult for the viewer to notice the difference in contrast betweenthe first peripheral region FR1 and the second peripheral region FR2. Inthis manner, the first wiring lines DPL are not coupled to the scanninglines GL, and therefore, can be said to be dummy wiring for the secondwiring lines GPL.

As described above, the display device 1 includes the array substrate10, the counter substrate 20, the liquid crystal layer 50, and the lightsource 3. The array substrate 10 includes the pixel electrodes PEserving as first light-transmitting electrodes each disposed in acorresponding one of the pixels Pix. The array substrate 10 is providedwith the signal lines SL arranged with spaces therebetween in the firstdirection PX and the scanning lines GL arranged with spaces therebetweenin the second direction PY. The counter substrate 20 includes the commonelectrodes CE serving as second light-transmitting electrodes inpositions overlapping the pixel electrodes PE in the plan view. Theliquid crystal layer 50 includes the polymer-dispersed liquid crystalsLC filled between the array substrate 10 and the counter substrate 20.The light emitters 31 of the light source 3 emit the light in the seconddirection PY to a side surface of the counter substrate 20. Thedirection of incidence of the light that propagates in the arraysubstrate 10 and the counter substrate 20 is the second direction. Thelight emitters 31 may emit the light that propagates in the arraysubstrate 10 and the counter substrate 20 toward a side surface of thearray substrate 10.

The array substrate 10 includes the signal lines SL arranged with spacestherebetween in the first direction PX and the scanning lines GLarranged with spaces therebetween in the second direction PY in thedisplay region AA. The first peripheral region FR1 outside the displayregion AA includes a plurality of first wiring lines DPL that aresupplied with a constant potential. In the second peripheral region FR2located opposite to the first peripheral region FR1 with the displayregion AA therebetween, a plurality of second wiring lines GPL coupledto the scanning lines GL are arranged. This configuration allows thebackground BS1 to be visible in the first peripheral region FR1 or thesecond peripheral region FR2 outside the display area AA without anysense of discomfort even if the first peripheral region FR1 is comparedwith the second peripheral region FR2.

Second Embodiment

FIG. 22 is a plan view for explaining the peripheral region according toa second embodiment of the present disclosure. FIG. 23 is a plan viewexplaining a first portion of the peripheral region of the secondembodiment in an enlarged view. FIG. 24 is a plan view explaining asecond portion of the peripheral region of the second embodiment in anenlarged view. FIG. 25 is a sectional view schematically illustrating asection along XXV-XXV′ of FIG. 23 . The same components as thosedescribed in the embodiment described above are denoted by the samereference numerals, and the description thereof will not be repeated.

As illustrated in FIG. 22 , the first wiring lines DPL are disposed in afirst portion Q11 of the first peripheral region FR1. In a secondportion Q21 of the second peripheral region FR2, the second wiring linesGPL coupled to the scanning lines GL are arranged.

In the second embodiment, as illustrated in FIG. 23 , the first wiringlines DPL extend so as to form a first angle α with respect to thesecond direction PY. The extending direction of the first wiring linesDPL is non-orthogonal to the second direction PY. In the secondembodiment, in the same manner as in the first embodiment, the directionof incidence of the light-source light L is the second direction PY.Therefore, the extending direction of the first wiring lines DPL isnon-orthogonal to the direction of incidence of the light-source lightL. When the first wiring lines DPL extend at an angle to the seconddirection PY, the light-source light L is reflected in a directiondifferent from the second direction PY at edges of the first wiringlines DPL, thus being difficult to be noticed.

In the first peripheral region FR1, a mesh-shaped metal layer FCM1 isprovided outside a region occupied by the first wiring lines DPL. Themetal layer FCM1 is coupled to the common potential drive circuit 45illustrated in FIG. 2 and serves as a portion of the common potentialwiring COML described above. This configuration reduces noise that wouldbe generated in the display region AA. The first wiring lines DPL areelectrically coupled to the metal layer FCM1 through third wiring linesCPL. The third wiring lines CPL are arranged with spaces therebetween inthe second direction PY. The spaces between the adjacent third wiringlines CPL are preferably greater than the spaces between the adjacentscanning lines GL. This configuration makes the third wiring lines CPLless noticeable and invisible.

In the second embodiment, as illustrated in FIG. 24 , the second wiringlines GPL extend so as to form a second angle β with respect to thesecond direction PY. The extending direction of the second wiring linesGPL is non-orthogonal to the second direction PY. In the secondembodiment, in the same manner as in the first embodiment, the directionof incidence of the light-source light L is the second direction PY.Therefore, the extending direction of the second wiring lines GPL isnon-orthogonal to the direction of incidence of the light-source lightL. When the second wiring lines GPL extend at an angle to the seconddirection PY, the light-source light L is reflected in a directiondifferent from the second direction PY at edges of the second wiringlines GPL, thus being difficult to be noticed. In the second embodiment,the first angle α is substantially equal to the second angle β. Thisconfiguration makes it difficult for the viewer to notice the differencein contrast between the first peripheral region FR1 and the secondperipheral region FR2.

In the second peripheral region FR2, a mesh-shaped metal layer FCM2 isprovided outside a region occupied by the second wiring lines GPL. Themetal layer FCM2 is coupled to the common potential drive circuit 45illustrated in FIG. 2 and serves as a portion of the common potentialwiring COML described above. This configuration reduces noise that wouldbe generated in the display region AA. At least one of the metal layersFCM1 and FCM2 is electrically coupled to the common electrode CE of thecounter substrate 20 through a conductive pillar. The conductive pillarmay also be a sealing material containing conductive particles such asAu particles.

As illustrated in FIG. 25 , the metal layer FCM1 is formed in the samelayer as that of the first wiring lines DPL and is formed of the samematerial as that of the first wiring lines DPL. The light-blocking layerLS does not cover the metal layer FCM1. As a result, the firstperipheral region FR1 is not provided with the light-blocking layer LS,and therefore, easily transmits light. Since the metal layer FCM1 ismesh-shaped, light passes through openings where no metal is present. Inthe same manner, the metal layer FCM2 is formed in the same layer asthat of the second wiring lines GPL and is formed of the same materialas that of the second wiring lines GPL. The light-blocking layer LS doesnot cover the metal layer FCM2. As a result, the second peripheralregion FR2 is not provided with the light-blocking layer LS, andtherefore, easily transmits light.

In the second embodiment, as illustrated in FIG. 22 , the shape of themetal layer FCM1 occupying the first peripheral region FR1 is obtainedby the shape of the metal layer FCM2 occupying the second peripheralregion FR2, in a mirror-symmetrical manner. This configuration makes itdifficult for the viewer to notice the difference in contrast betweenthe first peripheral region FR1 and the second peripheral region FR2.

First Modification of Second Embodiment

FIG. 26 is a plan view explaining the first portion of the peripheralregion according to a first modification of the second embodiment in anenlarged view. The same components as those described in either of theembodiments described above are denoted by the same reference numerals,and the description thereof will not be repeated.

In the first modification of the second embodiment, as illustrated inFIG. 23 , if a first side of the mesh-shaped metal layer FCM1 extends inthe first direction PX, the first side is orthogonal to the direction ofincidence of the light-source light L. In that case, the light-sourcelight L hits the first side of the mesh-shaped metal layer FCM1, andreflected light is likely to be generated as illustrated in FIG. 25 .The reflected light may reach the viewer as diffracted light and maycause the viewer to perceive partial coloration. Therefore, in the firstmodification of the second embodiment, the mesh-shaped metal layer FCM1is formed to have a diamond-shaped pattern. The direction of incidenceis non-orthogonal to the first side of the metal layer FCM1 forming themesh. In addition, the direction of incidence is non-orthogonal to asecond side of the metal layer FCM1 that forms the mesh and extends in adirection different from that of the first side. As a result, thereflected light is scattered and is difficult to be recognized by theviewer. As a result, the partial coloration of the first peripheralregion FR1 is reduced.

In the first modification of the second embodiment, the mesh-shapedmetal layer FCM1 extends so as to form a third angle γ with respect tothe second direction PY. The third angle γ is larger than the firstangle α. This configuration makes it difficult to cause the diffractionby the interaction between the mesh-shaped metal layer FCM1 and thefirst wiring lines DPL.

In the first modification of the second embodiment, the description hasbeen made by exemplifying the mesh-shaped metal layer FCM1. The sameeffect can also be obtained by forming the metal layer FCM2 illustratedin FIG. 24 to have a diamond-shaped pattern. In FIG. 24 , the directionof incidence of the light-source light L is non-orthogonal to the firstside of the metal layer FCM2 forming the mesh. In addition, thedirection of the incidence of the light-source light L is non-orthogonalto the second side of the metal layer FCM2 that forms the mesh andextends in a direction different from that of the first side. As aresult, the reflected light is scattered and is difficult to berecognized by the viewer. As a result, the partial coloration of thesecond peripheral region FR2 is reduced.

Second Modification of Second Embodiment

FIG. 27 is a plan view explaining the first portion of the peripheralregion according to a second modification of the second embodiment in anenlarged view. The same components as those described in any of theembodiments and the modification described above are denoted by the samereference numerals, and the description thereof will not be repeated.

In the second modification of the second embodiment, the third wiringlines CPL extend so as to form a fifth angle ε with respect to thesecond direction PY. The extending direction of the third wiring linesCPL is non-orthogonal to the direction of incidence of the light-sourcelight L. When the third wiring lines CPL extend at an angle to thesecond direction PY, the light-source light L is reflected in adirection different from the second direction PY at the edge of thethird wiring lines CPL, thus being difficult to be noticed.

The third wiring lines CPL preferably extend in the same direction asthat of the first side or the second side of the metal layer FCM1. Thisconfiguration matches the third angle γ with the fifth angle ε, andthus, makes the third wiring lines CPL more likely to be invisible.

Third Modification of Second Embodiment

FIG. 28 is a plan view explaining the first portion of the peripheralregion according to a third modification of the second embodiment in anenlarged view. FIG. 29 is a plan view explaining the second portion ofthe peripheral region according to the third modification of the secondembodiment in an enlarged view. The same components as those describedin any of the embodiments and the modifications described above aredenoted by the same reference numerals, and the description thereof willnot be repeated.

In the third modification of the second embodiment, the mesh-shapedmetal layer FCM1 extends so as to form a third angle δ with respect tothe second direction PY. The third angle δ is substantially the sameangle as the first angle α. Thus, the angle formed by the first side ofthe mesh-shaped metal layer FCM1 and the direction of incidence of thelight-source light L (third angle δ) is the same as the angle formed bythe extending direction of the first wiring lines DPL and the directionof the incidence of the light-source light L (first angle α) . Thisconfiguration makes the boundary between the mesh-shaped metal layerFCM1 and the first wiring lines DPL less noticeable.

A distance P1 in the first direction PX between adjacent first wiringlines DPL is substantially the same as a distance P2 in the firstdirection PX between the metal layer FCM1 and the first wiring line DPLadjacent to each other. The expression that a distance is “substantiallythe same as” a distance means that the difference between the twodistances is within a range up to a difference of not greater than thewidth in the first direction PX of the first wiring line DPL (the sameapplies hereinafter in the present disclosure). This configuration makesthe boundary between the mesh-shaped metal layer FCM1 and the firstwiring lines DPL less noticeable.

In the mesh-shaped metal layer FCM1, a gap between two bends has amaximum distance P4 in the first direction PX. A distance P3 in thefirst direction PX between a mesh line (first mesh line) of the metallayer FCM1 adjacent to the first wiring lines DPL and a mesh line(second mesh line) thereof adjacent to and parallel to the first meshline is shorter than the distance P4.

In FIG. 29 , the direction of incidence of the light-source light L(second direction PY) is non-orthogonal to the first side of the metallayer FCM2 forming the mesh. In addition, the direction of incidence ofthe light-source light L is non-orthogonal to the second side of themetal layer FCM2 that forms the mesh and extends in a directiondifferent from that of the first side. As a result, the reflected lightis scattered and is difficult to be recognized by the viewer. As aresult, the partial coloration of the second peripheral region FR2 isreduced. The mesh-shaped metal layer FCM2 extends so as to form a fourthangle θ with respect to the second direction PY. The fourth angle θ issubstantially the same angle as the second angle β. This configurationmakes the boundary between the mesh-shaped metal layer FCM2 and thesecond wiring lines GPL less noticeable.

In the second peripheral region FR2, the mesh-shaped metal layer FCM2 isprovided outside the region occupied by the second wiring lines GPL. Ifthe distance in the first direction PX between the metal layer FCM2 andthe second wiring line GPL adjacent to each other is longer than adistance P11 in the first direction PX between adjacent second wiringlines GPL, a space between the metal layer FCM2 and the second wiringlines GPL may be noticeable and visible. Therefore, as illustrated inFIG. 29 , fourth wiring lines DGPL are disposed in a region between themetal layer FCM2 and the second wiring lines GPL.

The fourth wiring lines DGPL are formed in the same layer as that of thescanning lines GL and are formed of the same material as that of thescanning lines GL. The fourth wiring lines DGPL are dummy wiring for thesecond wiring lines GPL and are not electrically coupled to the gatedrive circuit 43 and the scanning lines GL. The fourth wiring lines DGPLare coupled to the common potential drive circuit 45 illustrated in FIG.2 and are at substantially the same potential as that of the commonpotential wiring COML described above. The potential of the fourthwiring lines DGPL is not limited to the common potential and only needsto be a constant potential. Since the dummy wiring extending in the samedirection as the extending direction of the second wiring lines GPL isdisposed between the metal layer FCM2 and the second wiring lines GPL,the space between the metal layer FCM2 and the second wiring lines GPLis made invisible.

A distance P12 in the first direction PX between adjacent fourth wiringlines DGPL is substantially the same as the distance P11 describedabove. The distance in the first direction PX between the fourth wiringline DGPL and the second wiring line GPL adjacent to each other is alsosubstantially the same as the distance P11 described above. A distanceP13 in the first direction PX between the metal layer FCM2 and thefourth wiring line DGPL adjacent to each other is substantially the sameas the distance P12. This configuration makes the boundary between thefourth wiring lines DGPL and the mesh-shaped metal layer FCM2 lessnoticeable.

In the mesh-shaped metal layer FCM2, the gap between two bends has amaximum distance P15 in the first direction PX. A distance P14 in thefirst direction PX between a mesh line (first mesh line) of the metallayer FCM2 adjacent to the fourth wiring lines DGPL and a mesh line(second mesh line) thereof adjacent to and parallel to the first meshline is shorter than the distance P15.

Fourth Modification of Second Embodiment

FIG. 30 is a plan view explaining the first portion of the peripheralregion according to a fourth modification of the second embodiment in anenlarged view. FIG. 31 is a plan view explaining the second portion ofthe peripheral region according to the fourth modification of the secondembodiment in an enlarged view. The same components as those describedin any of the embodiments and the modifications described above aredenoted by the same reference numerals, and the description thereof willnot be repeated.

As illustrated in FIG. 30 , in the mesh-shaped metal layer FCM1, the gapbetween two bends has the maximum distance P4 in the first direction PX.The distance P3 in the first direction PX between a mesh line (firstmesh line) of the metal layer FCM1 adjacent to the first wiring linesDPL and a mesh line (second mesh line) thereof adjacent to and parallelto the first mesh line is substantially the same as the distance P4.This configuration makes the boundary between the mesh-shaped metallayer FCM1 and the first wiring lines DPL less noticeable.

In the mesh-shaped metal layer FCM2, the gap between two bends has themaximum distance P15 in the first direction PX. The distance P14 in thefirst direction PX between a mesh line (first mesh line) of the metallayer FCM2 adjacent to the fourth wiring lines DGPL and a mesh line(second mesh line) thereof adjacent to and parallel to the first meshline is substantially the same as the distance P15. This configurationmakes the boundary between the mesh-shaped metal layer FCM2 and thefourth wiring lines DGPL less noticeable.

While the preferred embodiments have been described above, the presentdisclosure is not limited to such embodiments. The content disclosed inthe embodiments is merely an example, and can be variously modifiedwithin the scope not departing from the gist of the present disclosure.Any modifications appropriately made within the scope not departing fromthe gist of the present disclosure also naturally belong to thetechnical scope of the present disclosure.

For example, the present disclosure has been described on the assumptionthat the switching element Tr has a bottom-gate structure. However, asdescribed above, the switching element Tr is not limited to thebottom-gate structure, and may have a top-gate structure. If theswitching element Tr has the top-gate structure, referring to thelayered insulating film structure of FIG. 15 , the structure will besuch that the semiconductor layer SC is disposed between the firstlight-transmitting base member 19 and the first insulating layer, thegate electrode GE is disposed between the first insulating layer 11 andthe second insulating layer 12, and the source electrode SE and thecontact electrode DEA are formed between the second insulating layer 12and the third insulating layer 13.

In addition, a direct-current voltage may be supplied as the commonpotential. In other words, the common potential may be constant.Alternatively, an alternating-current voltage may be shared as thecommon potential. In other words, the common potential may have twovalues of an upper limit value and a lower limit value. Whether thecommon potential is a direct-current potential or an alternating-currentpotential, the common potential is supplied to the holding capacitanceelectrode IO and the common electrode CE.

As the third insulating layer 13 serving as a grid-shaped organicinsulating film, the structure is disclosed in which the thirdinsulating layer 13 inside the grid-shaped region is entirely removed,and the second insulating layer 12 and the holding capacitance electrodeIO in the lower layers are exposed. However, the present disclosure isnot limited to this structure. For example, the structure may beobtained by using a halftone exposure technique to leave a thin part ofthe third insulating layer 13 inside the grid-shaped region surroundedby the signal lines SL and the scanning lines GL. With this structure,the thickness of the third insulating layer 13 inside the grid-shapedregion is made less than the thickness of the grid-shaped regionsurrounded by the signal lines SL and the scanning lines GL.

In the third modification and the fourth modification of the secondembodiment, the fourth wiring lines DGPL may be eliminated, and thesecond wiring lines GPL may be disposed instead of the fourth wiringlines DGPL.

What is claimed is:
 1. A display device comprising: an array substrate;a counter substrate including a first side surface and a second sidesurface opposed to the first side surface; a liquid crystal layerbetween the array substrate and the counter substrate; and a lightsource disposed so as to emit light from a side of the second sidesurface toward a side of the first side surface, wherein the arraysubstrate comprises, in a display region: a plurality of signal linesarranged in a first direction with spaces between the signal lines; anda plurality of scanning lines arranged in a second direction with spacesbetween the scanning lines, a mesh-shaped metal layer is provided in aperipheral region outside the display region, a direction of incidenceof light from the side of the second side surface closest to the lightsource toward the side of the first side surface is non-orthogonal to afirst line forming a mesh of the mesh-shaped metal layer, the first lineextends in a third direction different from the first direction and thesecond direction, the direction of incidence of the light isnon-orthogonal to a second line that forms the mesh of the mesh-shapedmetal layer, and the second line extends in a fourth direction differentfrom the first direction, the second direction, and the third direction.2. The display device according to claim 1, wherein the liquid crystallayer comprises polymer-dispersed liquid crystals, and in the peripheralregion, a background of the counter substrate is visible from the arraysubstrate, and a background of the array substrate is visible from thecounter substrate.
 3. The display device according to claim 2, whereinthe mesh of the mesh-shaped metal layer has a diamond-shaped pattern. 4.The display device according to claim 2, wherein the counter substratecomprises a light-blocking layer that at least partially covers thesignal lines and the scanning lines, and the light-blocking layer doesnot cover the mesh-shaped metal layer.
 5. The display device accordingto claim 2, wherein the mesh-shaped metal layer is in a same layer asthat of the scanning lines.
 6. The display device according to claim 2,wherein the array substrate further comprises an organic insulatinglayer, the organic insulating layer has a grid shape that extends alongthe scanning lines and the signal lines, in the display region, and themesh-shaped metal layer is entirely covered by the organic insulatinglayer, in the peripheral region.
 7. The display device according toclaim 6, wherein the array substrate further comprises a transparentcommon electrode on the organic insulating layer, and the mesh-shapedmetal layer is entirely covered by the transparent common electrode, inthe peripheral region.